1. The new generation of packaging technology COF (Chip On Flex or Chip On Film) packaging has become one of the main ways to package flat panel display driver ICs because it meets the development trend of short, light and thin. The copper plating method is that after the polyimide film undergoes various pretreatments, copper or other metals are sputtered on the film to form a thin conductive layer, and then the copper layer is formed by wet electroplating.
2. Production conditions
| project | Details | ||||
| Equipment installation environment | temperature [°C] | normal temperature | |||
| Humidity [%] | General ambient humidity | ||||
| Installation location | meet equipment placement | ||||
| Equipment energy requirements | Rated voltage | 3-phase 3-wire type 380V (electric cabinet and fire cow are equipped with independent switches respectively) | |||
| Rated frequency | 50Hz | ||||
| rated power | KW | ||||
| Power outage protection | PC computer comes with ups after being powered | ||||
| compressed air | 5.0 ~ 6. 0 kgf/? | ||||
| CW Water | Supply pressure: 1.0 ~ 2.5 kgf/? , | ||||
| Supply temperature: 14 ~ 22℃ (seasonal difference occurs) | |||||
| Dosage: 1000L/Hr | |||||
| cold water | Supply pressure: 1.0 ~ 3. 0 kgf/? | ||||
| Supply temperature: 7 ~ 11℃ | |||||
| DI Water | Supply pressure: 1.0 ~ 2. 0 kgf/? , | ||||
| Available within 60 minutes | |||||
| exhaust | The medicine tank and the copper tank have ventilation by the side of the tank, and the overall environment is exhausted. | ||||
| Suction flow rate: 5~8Meter /sec | |||||
| drain | Waste liquid: copper sulfate wastewater (UPVC pipe diameter daily gauge Dia2"), comprehensive wastewater (UPVC pipe diameter daily gauge Dia2"). | ||||
| The drainage time in the tank is less than 60 minutes | |||||
| Water and electricity in place | Provided by the customer for various needs, the pipeline is connected to the equipment within 1 meter. | ||||
| Appearance of the device | device size | (L)22000mm * (W)4900mm * (H)4000mm | |||
| Equipment weight (kg) | ( ) | ||||
| Basic Specifications | input direction | Provided by customer □ Left → Right □ Right→ Left | |||
| device color | Color: Rack stainless steel natural color. Electric cabinet off-white. | ||||
| Consult with the person in charge when using colors other than basic colors | |||||
| Pass Line | □ Lower Space 280mm (plating equipment) | ||||
| language used | Traditional Chinese or Simplified Chinese. | ||||
| HMI: Simplified Chinese | |||||
| Safety confirmation | Various warning slogans, hardware emergency switches, safety ropes, and transmission mechanisms are all covered with safety. | ||||
3. Circuit board specifications
| No | project | details | |||
| 1 | Board size | 250 * 200mm (standard) | |||
| 2 | Board thickness | Min 0.04mm ~ Max 1.0mm | |||
| 3 | hole size | Min Φ0.05mm ~ Max Φ1.0mm | |||
| Through hole AR 6 : 1 (90%); Blind hole AR 1 : 2 (80%) | |||||
4. Quality specifications
| No | project | details | |||
| 1 | Average Thickness Requirements | 12? | |||
| COV≦6% | |||||
| 2 | Test method for thickness of copper plating on board | Measurement position: according to the picture, each side is equidistant to 15 points (except for the side, up, down, left and right 20mm) | |||
| Measurement quantity: 30 point/pnl(15point/side), 6pnl measurement | |||||
| → Total 180 point measurement | |||||
| Measuring machine plate: 250mm × 200mm | |||||
| Assay method: Micro Section | |||||
| Thickness deviation: ±10 % | |||||
| 3 | Through hole capability | Measurement place: 5 points as shown in the picture (except for the 20mm up and down, left and right) | |||
| Bitmap | |||||
| Number of measurements: 5 points/pnl, 3pnl measurements→ Total section | |||||
| Measuring machine version: 250mm × 200mm | |||||
| (including 0.075Φ, 0.10Φ, 0.15 board) | |||||
| Determination method: Slice observation of each point. | |||||
| Through hole capability: ±100 % (see table below for details) | |||||
| Bitmap | |||||
| · Minimum through hole φ: 0.25mm | |||||
| · Maximum plate thickness: 1.0mm | |||||
| · Maximum aspect ratio = 6.4 : 1 | |||||
| Through hole calculation: | |||||
| Hole Plating Thickness (5~10 Min) / Surface Thickness (1~4 Average) × 100% | |||||
